The 9th Meeting of the SEMI China Packaging and Testing Committee was held at our company.
Release date:
2015-11-19
On November 18, 2015, the 9th Meeting of the SEMI China Packaging and Testing Committee was held in our company's VIP Conference Hall. Over 40 attendees participated, including representatives from China's semiconductor packaging and testing industry, industry experts, and personnel from government departments. Company General Manager Shi Lei delivered an overview of the company's development, while Nantong Vice Mayor Huang Aijun and Chairman of the company, Shi Mingda, attended the meeting and delivered speeches.
On November 18, 2015, the 9th Meeting of the SEMI China Packaging and Testing Committee was held in our company's VIP Conference Hall. Over 40 representatives attended, including business leaders from China's semiconductor packaging and testing industry, industry experts, and personnel from government departments. Company General Manager Shi Lei delivered an overview of the company's development, while Nantong Vice Mayor Huang Aijun and Chairman of the company, Shi Mingda, also attended and delivered speeches at the event.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
