On October 17, the main structure of the primary factory building for Phase I of Hefei Tongfu Microelectronics Co., Ltd., a key project in Hefei Economic Development Zone for 2015, was successfully topped out. Yang Wei, Secretary of the EDZ Management Committee, Sun Yuzhou, Deputy Director, along with Shi Mingda, Chairman, and Shi Lei, President, of the investing party Nantong Fujitsu Corporation, as well as representatives from the construction and supervision teams, attended the topping-out ceremony.
Nantong Fujitsu Microelectronics Co., Ltd. was established in 1994 and is headquartered in Nantong City, Jiangsu Province. It ranks among China's top three IC packaging and testing companies, and more than half of the world's top ten semiconductor manufacturers are its customers. The company currently offers advanced packaging and testing technologies such as Bumping, WLCSP, FC, BGA, and SiP, as well as traditional packaging solutions like QFN, QFP, and SO. Additionally, it provides specialized packaging services for automotive electronics and MEMS products. In terms of testing, Nantong Fujitsu was the first domestic Chinese packaging and testing firm to achieve large-scale mass production of the entire post-process flow for 12-inch 28-nanometer mobile processor chips, encompassing key steps including Bumping, CP, FC, FT, and SLT.
Nantong Fujitsu Co. has recently established Hefei Tongfu Co. in Hefei Economic Development Zone, partnering with Hefei Industry Investment Guidance Fund Co., Ltd. and Hefei Haiheng Investment Holding Group Co., Ltd. The company is located at the southeast corner of Yungu Road and the southwest corner of Hezhang Road within the zone. The project spans approximately 198 mu of land, with a total construction area of 180,000 square meters, including 94,000 square meters dedicated to production facilities. Completion and operation are scheduled for early 2016. Once fully operational, the project will position the Economic Development Zone as a key manufacturing base for advanced packaging technologies.
Mr. Shi Lei, President of Nantong Fujitsu Company, the investor, delivered a speech at the topping-out ceremony, stating that they will build Hefei Tongfu into a world-class, green benchmark factory featuring the most comprehensive process technologies, the highest level of technical expertise, the most advanced automation systems,一流的环保 standards, and一流的 energy efficiency.
Sun Yuzhou, Deputy Director of the Economic Development Zone Management Committee, congratulated everyone on the capping ceremony of the main factory building for the first-phase project of Hefei Tongfu Microelectronics. He also emphasized that all departments within the Economic Development Zone will continue to provide comprehensive support for the project's construction, actively working to create a harmonious and high-quality service environment—both in terms of policies and resource allocation—to facilitate the growth and development of Hefei Tongfu. Together with the investor, they will accelerate the progress of the integrated circuit packaging project at Hefei Tongfu Company, contributing further to Hefei City's ambition of becoming the "IC Capital."
