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Tongfu Microelectronics' 2022 Annual Meeting Held Grandly

Release date:

2022-01-20

On the afternoon of January 15, Tongfu Microelectronics held its 2022 annual meeting with great solemnity at the group headquarters. This year's conference was themed "Proactively Taking Initiative, Striving Forward with Determination, and Continuing to Pursue the Tongfu Dream of High-Quality Development." President Shi Lei delivered the annual work report, while Chairman Shi Mingda shared his New Year message. The event was chaired by Xia Xin, Deputy General Manager of the Group.

　　On the afternoon of January 15, Tongfu Microelectronics' 2022 annual meeting was grandly held at the group headquarters. This year's conference was themed "Proactively Taking Initiative, Striving Forward with Determination, and Continuing to Pursue the Tongfu Dream of High-Quality Development." President Shi Lei delivered the annual work report, while Chairman Shi Mingda gave a New Year speech. The meeting was chaired by Xia Xin, the group's Deputy General Manager.

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　　In his annual work report, President Shi Lei highlighted that 2021 was the brightest year in Tongfu Microelectronics' history of development. During this year, the company achieved its best-ever business performance, building on last year's revenue exceeding 10 billion yuan and continuing to deliver substantial growth. Meanwhile, the company significantly boosted its market share and recorded its fastest-ever growth rate, further solidifying its industry-leading position. Additionally, more new product lines entered mass production, and an increasing number of cutting-edge packaging solutions were successfully ramped up for volume manufacturing. On the technological front, Tongfu Microelectronics once again set a new benchmark, earning the prestigious First Prize for National Scientific and Technological Progress. The "02 Special Project" also concluded smoothly, elevating the company's technical capabilities to an unprecedented level.

　　The president pointed out that in 2021, against the backdrop of a complex and challenging international environment coupled with historic opportunities for development, the group as a whole continued to uphold its spirit of relentless effort, seized the momentum, pressed forward with determination, and successfully achieved the goals and tasks set at the beginning of the year.

　　The president emphasized that in 2021, we seized the opportunity and took a significant step toward achieving our high-quality Tongfu Dream goal. In the coming year, Tongfu Microelectronics will focus on nine key areas: firmly upholding four critical bottom lines, optimizing the financial and economic system, driving robust management reforms, placing customers at the center of our strategy, concentrating JVs on three major priorities, enhancing operational efficiency and quality, amplifying the impact of our accolades, steadily advancing project development, and strengthening corporate culture building. By working collaboratively, leveraging our strengths, boldly scaling new heights, and striving for continued excellence, we’re poised to rewrite our success story once again.

　　At the annual meeting, Chairman Shi Mingda delivered a passionate New Year speech. He said that 2021 was a year filled with significant and joyful milestones for the company. On behalf of the company and the board of directors, he extended his warmest holiday greetings to all employees—both at home and abroad—who have tirelessly dedicated themselves to Tongfu’s success, as well as to their families, who have provided steadfast support throughout the year!

　　At the meeting, awards were also presented to representatives who won the 2021 Science and Technology Progress Award.

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