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Tongfu Microelectronics Holds Successful Mass Production Report Meeting for China's First 12-Inch 28nm Advanced Packaging and Testing Full-Process Production Line

Release date:

2015-05-07

On the afternoon of May 5, 2015, our company held a successful production milestone report meeting for the 12-inch 28nm advanced packaging and testing full-process line (Bump + CP + FC + FT + SLT).

On the afternoon of May 5, 2015, our company held a successful production report meeting for the 12-inch 28nm advanced packaging and testing full-process production line (Bump + CP + FC + FT + SLT).

Tongfu Microelectronics General Manager Shi Lei reported on the successful mass production of the company’s 12-inch, 28-nanometer advanced packaging and testing full-process production line. This cutting-edge packaging and testing line represents a significant achievement for Tongfu Microelectronics, made possible by the continuous support of China’s national key science and technology projects. Not only is it the first of its kind in China, but with a yield rate as high as 99.9%, it has reached world-class technical standards, filling a critical domestic gap and marking a landmark accomplishment. These packaged products have already been successfully integrated into domestically branded smartphones, a milestone that not only underscores the importance of our company but also holds profound implications for the development of China’s integrated circuit industry chain.

Key customer representatives attending the meeting also delivered speeches, highly praising our company’s advanced 12-inch 28-nanometer full-process packaging and testing technology and products, and expressed their hope to strengthen cooperation in more areas in the future.

The attending leaders and experts delivered speeches, expressing their hope that the company would take this significant technological breakthrough as a new starting point to relentlessly pursue innovation, strive for excellence, and make greater contributions toward achieving a leap-forward development of China's integrated circuit industry.