Hu Yongjun, Secretary of the Chongchuan District Committee, visits and extends condolences to Shi Lei, President of Tongfu Microelectronics, a representative of high-level talents.
Release date:
2022-01-29
On January 27, the Tongfu Tongke project site within the Tongke Industrial Park, located in the North High-tech Zone of the city, was bustling with activity. Standing on-site was Shi Lei, the president of Tongfu Microelectronics and a distinguished talent from Chongchuan.
On January 27, the Tongfu Tongke project site within the Tongke Industrial Park, located in the North High-Tech Zone of the city, was bustling with activity. Standing on-site was Shi Lei, the outstanding talent from Chongchuan and President of Tongfu Microelectronics. This year, the "Key Technologies and Complete Process for High-Density, High-Reliability Electronic Packaging," a project he spearheaded as the primary contributor, earned the prestigious First Prize for National Scientific and Technological Progress. Meanwhile, the province's first integrated circuit packaging and testing industry collaborative innovation consortium—led by Tongfu Microelectronics—is rapidly advancing, attracting more companies across the upstream and downstream segments of the IC industry chain. Key technological breakthroughs and collaborative innovations are gaining momentum. Hu Yongjun extended his heartfelt Lunar New Year greetings to Shi Lei, thoroughly inquiring about his work, personal life, and ongoing research. He congratulated Shi Lei on his remarkable achievements in the field of IC packaging, expressed gratitude for his significant contributions to Chongchuan's development, and encouraged him to continue leading his research team with unwavering dedication, aiming for even greater accomplishments in the future.
Following this, Hu Yongjun reviewed the project's progress. It was introduced that Tongfu Microelectronics is investing in and constructing an advanced packaging and testing facility in the North High-tech Zone, a site with strong market demand and high technological standards. This initiative aims to expand cutting-edge packaging and testing capacity, address critical bottlenecks in the industry, and further solidify the company’s leading position in the sector. The project primarily involves building production lines for high-end integrated circuit chips, including memory devices, power management solutions, and 5G-related products. Hu Yongjun emphasized that Chongchuan District will continue to strengthen its support for businesses, optimize the business environment, and create more opportunities for companies to thrive.
President Shi Lei expressed his gratitude for the Long-term support and assistance from the District Committee and District Government. He stated that the company will further intensify its efforts in technological innovation, actively promote enterprise development, and contribute even more of Tongfu's strength to the economic and social progress of Chongchuan.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
