City and district leaders congratulated the company on winning the 2020 National First Prize for Scientific and Technological Progress.
Release date:
2021-11-09
At the recently held 2020 National Science and Technology Awards Conference, Tongfu Microelectronics, as the primary completing unit, and Shi Lei, President of Tongfu Microelectronics, as the principal contributor, jointly received the First Prize for National Scientific and Technological Progress for their project titled "Key Technologies and Complete Process for High-Density, High-Reliability Electronic Packaging."
At the recently held 2020 National Science and Technology Awards Conference, Tongfu Microelectronics, as the primary completing unit, and Shi Lei, President of Tongfu Microelectronics, as the principal contributor, were awarded the First Prize for National Scientific and Technological Progress for their project titled "Key Technologies and Complete Process for High-Density, High-Reliability Electronic Packaging." On November 8, Wang Hui, Secretary of the Municipal Party Committee, along with Wu Xinming, Deputy Secretary of the Municipal Party Committee and Acting Mayor, met with Shi Mingda, Chairman of the company, and Shi Lei, President, extending warm congratulations to both and expressing profound respect to all the scientific and technical personnel who contributed to the project's development. Shen Lei, Deputy Secretary of the Municipal Party Committee and Minister of the Publicity Department, also attended the meeting.
On November 7, Hu Yongjun, Secretary of the Chongchuan District Committee, along with Yang Wanping, Deputy Secretary of the District Committee and Acting District Mayor, led a delegation to Tongfu Microelectronics to congratulate the company on winning the 2020 National First Prize for Scientific and Technological Progress.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
