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Tongfu Microelectronics' first piece of equipment arrives at the 2.5D/3D production line.

Release date:

2021-08-26

On the morning of August 19, the first piece of equipment—Chemical Mechanical Polishing (CMP) machinery—for Tongfu Microelectronics' 2.5D/3D production line was successfully moved into Tongfu's Nantong facility, marking the full transition of the line into the equipment installation, commissioning, and engineering validation phases. This milestone ushers in a new chapter for Tongfu Microelectronics as it embarks on the advanced 2.5D/3D packaging arena.

　　On the morning of August 19, the first piece of equipment—Chemical Mechanical Polishing (CMP) machinery—for Tongfu Microelectronics' 2.5D/3D production line was successfully moved into Tongfu's Nantong factory, marking the full transition of the line into the equipment installation, commissioning, and engineering validation phases. This milestone ushers in a new chapter for Tongfu Microelectronics as it embarks on the advanced 2.5D/3D packaging arena.

　　Once the advanced packaging production line is completed, the company will become the most cutting-edge domestic R&D and mass-production base for 2.5D/3D advanced packaging, achieving a breakthrough in China’s high-performance packaging technology applied to HBM (High Bandwidth Memory). This milestone holds significant importance for the nation as it helps overcome critical "bottleneck" technologies in the integrated circuit packaging and testing sector.