Decades of dedicated, hard work have finally earned us a national-level award today!
Release date:
2021-11-03
The "Key Technologies and Complete Process for High-Density, High-Reliability Electronic Packaging," with Tongfu Microelectronics as the primary completing unit and President Shi Lei as the principal contributor, has proudly received the First Prize of the National Science and Technology Progress Award. This prestigious honor marks a milestone in the company's development, signifying that Tongfu Microelectronics has reached an unprecedented level—both in terms of scale and technological strength.
On November 3, the 2020 National Science and Technology Awards Ceremony was held at the Great Hall of the People in Beijing.
The "Key Technologies and Complete Process for High-Density, High-Reliability Electronic Packaging," with Tongfu Microelectronics as the primary completing unit and President Shi Lei as the principal contributor, has proudly received the First Prize of the National Science and Technology Progress Award. This prestigious honor marks a milestone in the company's development, signifying that Tongfu Microelectronics has reached an unprecedented level—both in terms of scale and technological strength.
As a leading enterprise in the industry, Tongfu Microelectronics has always taken it upon itself to revitalize China’s national integrated circuit industry—staying committed to its core business, remaining true to its original aspirations, and boldly stepping up to lead the way. For decades, Tongfu Microelectronics has been dedicated to the research and development of integrated circuit packaging technologies. This award-winning project stems from Tongfu Microelectronics’ role as the primary contractor for the 2017 National Key Project 02—specifically, the development of CPU packaging and testing technologies.
As the second principal contributor to this award-winning project, Tongfu Microelectronics President Shi Lei has been involved in its development since 2012. He led Tongfu Microelectronics to collaborate closely with leading domestic universities such as Huazhong University of Science and Technology and Wuhan University, as well as major domestic wafer manufacturers, in a joint R&D effort. Through this "industry-academia-research-application" collaboration among academia, research institutes, and enterprises, the team successfully overcame critical bottlenecks in high-density, high-reliability electronic packaging technology. Notably, breakthroughs were achieved in wafer-level packaging technologies, as well as in the packaging and testing of domestically produced CPUs/GPUs and memory devices—contributing significantly to the nation's efforts in building an independent and controllable integrated circuit industry chain.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
