Background requirements:
1. Undergraduate or graduate student majoring in electronic packaging, microelectronics, materials, electromechanical or physics;
2. At least 5 years of working experience in semiconductor packaging field (WB; FC; Memory; Bump; WLCSP; Fanout; COGCOF);
3. Proficient in using various office software; Familiar with relevant data analysis software is preferred;
Key skills and responsibilities:
1. Solve, handle and improve various process problems in the production process. Assist in product failure analysis, with DOE, SPC and other data analysis capabilities;
2. Assist in the development of packaging schemes, processes, processes and materials; Provide guidance for solving packaging production problems encountered in the process of packaging engineering Qual, small batch trial production and mass production import;
3. Assist the market to solve the client's problems about packaging technology