Senior Packaging Engineer
Release date:
2022-02-11
Background requirements:
1. Bachelor’s or master’s degree in a science and engineering field such as electronic packaging, microelectronics, materials, mechatronics, or physics;
2. 5+ years of work experience in the semiconductor packaging field (WB-type; FC; Memory; 2.5D & 3D; SIP; WLP; FO);
3. Proficient in using various office software; familiarity with relevant data analysis tools is a plus!
Key Skills and Responsibilities:
1. Resolve, address, and improve various process-related issues in the production workflow. Assist with product failure analysis and possess data analysis capabilities such as DOE and SPC.
2. Assist in the development of packaging solutions, processes, technologies, and materials; provide guidance on resolving packaging production issues encountered during Qualification, pilot runs, and the transition to mass production.
3. Assist the marketing team in addressing client inquiries related to packaging technology.
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Tongfu Microelectronics Co., Ltd.
Tongfu Microelectronics
Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China
Postal code: 226004
