Responsibilities:
1. Development and application of new technologies, processes and materials for chip packaging
2. Use professional software to simulate fluid, optics and electricity
3. Packaging product shape design, substrate design
Job requirements:
1. Master's degree or bachelor's degree in 985 universities, major in integrated circuit, electronic power, structural design (mechanical simulation), semiconductor materials, automation, communication, computer, electromechanical, mechanical, chemical and other related disciplines, research direction related to integrated circuit
2. Fluent in English listening, speaking, reading and writing
3. Healthy, cooperative, hardworking, brave to challenge, willing to contribute, and pursuing excellence
4. With two years or more working experience in the same industry, the degree can be extended to a first class undergraduate
5. Work location: Nantong