News

Home page

"Collaborate for Development, Achieve Win-Win Success to Shape the Future" — Tongfu Microelectronics' 2021 Supplier Conference Officially Held

Release date:

2021-03-31

On March 30, Tongfu Microelectronics held its Supplier Conference at the InterContinental Nantong International Hotel, themed "Collaborate for Development, Achieve Win-Win Results, and Create the Future." The event was attended by Tongfu Microelectronics Chairman Shi Mingda, President Shi Lei, the company's management team, and nearly 100 suppliers. The conference was chaired by Tongfu Microelectronics Vice President Xia Xin.

　　On March 30, Tongfu Microelectronics held its Supplier Conference at the InterContinental Nantong International Hotel, themed "Collaborate for Development, Win Together to Create the Future." The event was attended by Tongfu Microelectronics Chairman Shi Mingda, President Shi Lei, the company's management team, and nearly 100 suppliers. The conference was chaired by Tongfu Microelectronics Vice President Xia Xin.

　　Tongfu Microelectronics Vice President Xia Xin presides over the conference.

　　The conference began with a speech by Shi Lei, President of Tongfu Microelectronics. President Shi warmly welcomed all the guests and supplier partners who attended the meeting. He emphasized that this year marks a pivotal moment for Tongfu Microelectronics—a year to build on a strong foundation and embark on a new journey of advancement. By convening the Supplier Conference, Tongfu Microelectronics not only fulfills the mutual need for collaboration, growth, and shared success in shaping a brighter future, but also underscores the initiative's profound significance in revitalizing China's integrated circuit industry chain.

　　Shi Lei introduced that Tongfu Microelectronics boasts six major production bases: its headquarters factory, Nantong Tongfu, Hefei Tongfu, Xiamen Tongfu, Suzhou Tongfu, and Penang, Malaysia. Through strategic growth initiatives and mergers & acquisitions, the company has now risen to become the world's fifth-largest and China's second-largest leader in the industry. In 2020, despite the challenges posed by the COVID-19 pandemic and the global and domestic economic downturns, Tongfu Microelectronics achieved remarkable results—exceeding 10 billion yuan in revenue and generating over 50 billion yuan in output value—thanks to steadfast collaboration with its suppliers, relentless determination to overcome obstacles, and unwavering dedication. This outstanding performance underscores the tremendous success of their mutually beneficial partnership. On behalf of the company's management team, Shi Lei extends heartfelt gratitude to all our valued supplier partners!

　　Shi Lei stated that win-win cooperation has always been Tongfu Microelectronics' consistent business philosophy. Over the years, Tongfu Microelectronics has successively collaborated with Japan's Fujitsu and AMD, both of which have led to significant growth for all parties involved. In 2021, Tongfu Microelectronics continued to place great emphasis on fostering strong supplier relationships, expressing its commitment to jointly crafting strategic collaboration plans with suppliers. Together, we will remain united, continue our efforts, and strive to achieve even greater success in our collaborative endeavors.

　　Speech by Shi Lei, President of Tongfu Microelectronics

　　At the meeting, Mr. Zheng Ziqi, CTO of Tongfu Microelectronics' Advanced Packaging Division, and Mr. Cai Zhongxian, General Manager of Memory Technology at Tongfu Microelectronics, respectively presented updates on the company's advanced packaging technology R&D and Memory technology development. Their presentations laid a solid foundation for fostering deeper mutual understanding between the company and its suppliers, enabling seamless sharing of resources and information, and ultimately driving shared progress.

　　Mr. Zheng Ziqi, CTO of Tongfu Microelectronics Advanced Packaging, delivers an introduction on the research and development status of advanced packaging technologies.

　　Mr. Cai Zhongxian, General Manager of Memory Technology at Tongfu Microelectronics, delivered a presentation on the research and development status of memory technology.

　　At the subsequent thank-you dinner, Tongfu Microelectronics Chairman Shi Mingda delivered an impassioned toast.

Chairman Shi Mingda Delivers a Toast Speech

　　The convening of the conference clearly demonstrates that Tongfu Microelectronics and its suppliers are sincere, mutually supportive strategic partners committed to a win-win future. Tongfu Microelectronics will never forget the invaluable assistance provided by its domestic and international suppliers throughout the company’s growth and development—and both sides must work together to safeguard and enhance their shared interests. In 2021, as opportunities coexist with challenges, let us uphold the principle of mutual benefit and win-win cooperation, vigorously promote collaborative efforts across the industry chain, overcome difficulties together, and collectively contribute to the transformative advancement of China’s integrated circuit industry!

　　The conference also recognized 29 suppliers, awarding one each as the Best Supplier, Best Collaborative Supplier, Best Quality Supplier, and Best Supportive Supplier, along with five recipients of the Best Progress Award and 20 outstanding suppliers.

Return to list →