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Encapsulation material ICP report

Product ICP report

Encapsulation Materials ICP Report

Alpha Assembly-ATROX 800HT5-240920

349.8KB

Indium-SMQ51SC-240717

616.4KB

HENGHUI-EFTEC64T-240715

665.5KB

Resonac(JP)-EN-4900GC-240701

272.8KB

Tanaka-(GPH) Au Alloy Bonding Wire - 240627

661.4KB

Sumitomo-1191AR SERIES-240506

425.0KB

Flux-WF-6317-240418

712.7KB

Yonggu-S305N2-Halogen-240314

379.1KB

Yonggu-S305N2 ROHS-240314

411.2KB

HENGHUI-C7025-240423

742.4KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174