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Encapsulation material ICP report

Product ICP report

Encapsulation Materials ICP Report

SDI-LY65-250123

806.7KB

SDI-PMC90-240425

669.1KB

SH-C7025-241209

979.6KB

SH-Ag-241203

976.3KB

SH-C194-241203

975.2KB

SDI-LY80(TFe0.1)-240611

585.0KB

SH-12SnOFC+Ni-240603

448.4KB

Shinko-CDA194-241024

317.0KB

Shinko-EFTEC64T-241024

317.0KB

Shinko-Pd PLATING-241024

325.6KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174