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Encapsulation material ICP report

Product ICP report

Encapsulation Materials ICP Report

Shinko-Ni PLATING-241024

345.2KB

Shinko-Au PLATING-241024

335.9KB

Shinko-Ag PLATING-241024

330.9KB

Shinwon-PMC90 Bare-240531

349.8KB

Shinwon-HCL 12S-Ni-240531

354.0KB

Shinwon-PMC90 Ag-240531

343.7KB

Shinwon-HCL 02Z-NiNiP-240531

357.1KB

Yonghong-PMC90-241227

727.6KB

Yonghong-C194-241227

732.0KB

TSP-PMC90-240821

394.9KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174