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Encapsulation material ICP report

Product ICP report

Mold Compound

Sumitomo-EMEG311Q SERIES-240513

447.8KB

Sumitomo-EMEG311A SERIES-241113

445.8KB

Sumitomo-EMEG311AC SERIES-240517

365.6KB

Sumitomo-EME6600C SERIES-230228

536.6KB

Sumitomo-EMEE500 SERIES-240513

452.3KB

Sumitomo-EMEG600F SERIES-240614

614.4KB

Sumitomo-EMEE590H SERIES-240709

638.8KB

Sumitomo-EMEG600 SERIES-241030

443.4KB

Sumitomo-EMEG600TF SERIES-240614

440.0KB

Sumitomo-EMEG620-A SERIES-231130

448.1KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174