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Encapsulation material ICP report

Product ICP report

Mold Compound

Sumitomo-EMEE630 SERIES-240614

429.5KB

Sumitomo-EMEG630AY SERIES-240417

444.8KB

Sumitomo-EMEG631BQ SERIES-241113

442.0KB

Sumitomo-EMEE670 SERIES-240417

420.5KB

Sumitomo-EMEG631SH SERIES-241030

438.1KB

Sumitomo-EMEG700 SERIES-240709

439.3KB

Sumitomo-EMEG631H SERIES-240417

438.4KB

Sumitomo-EMEG700H SERIES-240614

455.4KB

Sumitomo-EMEG750N SERIES-241113

441.0KB

Sumitomo-EMEG700L SERIES-240709

620.3KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174