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Encapsulation material ICP report

Product ICP report

Wire

Nippon-EX1R-250120

547.1KB

Tanaka-(GPH) Au Alloy Bonding Wire - 240627

661.4KB

Tanaka-Pd Coating Cu Wire(CLR-1A)-240425

663.3KB

Heesung-HS-RF-240708-2

246.0KB

Heesung-HS-GPF-240709-2

242.7KB

Heesung-HS-ES5-240708-2

240.9KB

Doublink-HCP2-240510

442.4KB

Doublink-Cu-240921

448.1KB

Heraeus-HA3-240409

473.0KB

Doublink-Gold-241213

587.4KB

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Tongfu Microelectronics

Tongfu Micro

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Tongfu Microelectronics Co., Ltd.

Tongfu Microelectronics

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Postal code: 226004

Email: sales.enquiry@tfme.com

通富微 No. 32060202001174