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ABOUT US

Tongfu Microelectronics Co., Ltd.

Chips Create a Better Future with Infinite Possibilities

Tongfu Microelectronics (security code: 002156) as a Chinese integrated circuit (IC) encapsulation test service provider provides one-stop design simulation and encapsulation test services for global customers. Tongfu Microelectronics engages in products, technologies and services in many fields, including network communication, mobile terminals, household appliances, AI, auto electronics, etc. 

Tongfu Microelectronics headquarters is located in Nantong, Jiangsu Province. Tongfu Microelectronics possesses global manufacture and service bases and has built seven major production bases in Nantong, Hefei, Xiamen, Suzhou and Penang in Malaysia to provide global customers with fast and convenient services. Tongfu Microelectronics has more than 18,000 employees all over the world. Tongfu Microelectronics will cooperate with customers to march towards the objective of becoming a world-class IC encapsulation test enterprise with the support of national policies, market stimulation, drive of the demands of system manufacturers, collaborative development of the industry chain and support of the national industry fund. 

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Culture

Corporate Vision

Tongfu Microelectronics focuses on IC encapsulation tests, makes efforts to improve four core capabilities, including design and R&D, quality control, marketing and resource integration, and gradually builds “Tongfu Microelectronics” relying on strength, performance and contributions. 

Cultural Connotation

People orientation--boost corporate development, while laying emphasis on personal progress, and build a learning-oriented enterprise to make employees and the enterprise grow together. 

Core Values

Integrity, Customer Orientation, Commitment, Innovation

公司里程碑

2020

2020

3月31日,崇川车载品智能封测厂房封顶
2020

2020

3月26日,苏通二期首台设备进场
2019

2019

12月23日,厦门厂揭牌投产
2018

2018

2月27日,通富微电发布公告,富士通中国转让所持股份,交易完成后,国家大基金成为公司第二大股东。
2017

2017

厦门通富奠基(厦门厂)
2017

2017

销售额近10亿美元 拥有员工13000+ 工程师3000+ 服务全球客户300+
2016

2016

南通富士通更名为通富微电
2016

2016

收购AMD苏州与槟城各85%股权
2015

2015

南通通富成立(苏通厂)
2014

2014

合肥通富成立(合肥厂)
2008

2008

实施国家科技重大专项(02专项)
2007

2007

深交所上市002156
2003

2003

迁入崇川新工厂
1997

1997

与日本富士通合资成立南通富士通(中方控股)
TFME

Tongfu Microelectronics Co., Ltd. 

Address: No. 288 Chongchuan Road, Nantong, Jiangsu, China

Post code: 226004

Copyright © 2023 Tongfu Microelectronics Co., Ltd.  苏ICP备05003519号