Spare No Effort to Forge the Highland of Nantong IC Industry--Contract Signing of Tongfu Microelectronics Shibei Advanced Encapsulation Base Project
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- Time of issue:2022-07-08
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(Summary description)The contract signing activity of Tongfu Microelectronics Shibei Advanced Encapsulation Base Project was carried out in the morning on June 27.
Spare No Effort to Forge the Highland of Nantong IC Industry--Contract Signing of Tongfu Microelectronics Shibei Advanced Encapsulation Base Project
(Summary description)The contract signing activity of Tongfu Microelectronics Shibei Advanced Encapsulation Base Project was carried out in the morning on June 27.
- Categories:News
- Author:
- Origin:
- Time of issue:2022-07-08
- Views:0
The contract signing activity of Tongfu Microelectronics Shibei Advanced Encapsulation Base Project was carried out in the morning on June 27. Wu Xinming, Vice Secretary of the CPC Municipal Committee and the Mayor, attended the activity and delivered a speech. Other leaders who attended the activity included the Standing Committee Member of the CPC Municipal Committee and Standing Vice Mayor Lu Weidong, Party Member of the Municipal Government and the Secretary General Ling Yi, Director of the Municipal Government Office Chen Lin, Secretary of the District Party Committee hu Yongjun, etc. The president of Tongfu Microelectronics Shi Lei attended the activity. Vice Secretary of the District Party Committee and the District Head Yang Wanping, Director of the Management Committee of Shibei Hi-tech Zone Ding Zhixiang and the President of Tongfu Microelectronics Shi Lei signed the contract. Deputy General Manger of Tongfu Microelectronics Xia Xin, Hu Wenlong and Zhuang Zhenming, Deputy General Manger of the Factory Affairs Center Wu Pinzhong and the persons in charge of relevant departments witnessed the contract signing activity.
Mayor Wu Xinming showed congratulations on behalf of the Municipal Committee and the Municipal Government to the successful signing of the project. After briefly introducing the status quo of the IC industry in Nantong City, he expressed that Tongfu Microelectronics was a leading enterprise in the IC encapsulation test industry in China, this contract signing was a crucial step for Tongfu Microelectronics to realize the goal of “No.1 with both the market value and the output value of RMB 100 billion in China’s encapsulation field”, this would definitely attract and drive more upstream and downstream enterprises to invest in Nantong and inject new power into strong clustering development of the IC industry in Nantong city. Mayor Wu hoped that Tongfu Microelectronics could insist on leading the enterprise with innovation and empowering the enterprise with technologies, adopt the world most advanced equipment and process to forge the world first-class and domestic leading encapsulation base; further give play to the influence in the industry to drive more landmark projects, valuable enterprises and high-end talents on the industry chain to locate in Nantong. Mayor Wu also expressed that Nantong government and Chongchuan government would inherit the concepts of welcoming merchants, caring about merchants and guaranteeing the profitability of merchants, spare no effort to provide the most professional project service, the soundest element guarantee and the best business environment to boost the project to be commenced, constructed and put into operation quickly and work with the enterprise to realize dreams and create glories.
President Shi Lei thanked the long-term care and support of Municipal Committee and Municipal Government of Nantong City for the development of Tongfu Microelectronics. The president said that the advanced IC encapsulation base built by Tongfu Microelectronics in Shibei Hi-tech District of Nantong City mainly included several high-end IC chip encapsulation product lines: new-type three-dimensional memory, auto electronics, high-performance calculation, new energy and 5G, aiming to solve the bottleneck problem of advanced encapsulation, expand the output of advanced encapsulation and improve the leading position in this industry. The President said that Tongfu Microelectronics would accelerate the project construction, input more into research and development, strengthen talent cultivation and speed up improvement of management and make every effort to forge the new highland of the IC industry in Nantong City.
Hu Yongjun, secretary of Chongchuan District Party Committee, presided over the ceremony and said that the settlement of Tongfu Micro Electric Shibei Advanced Sealing and Testing Base Project will help Chongchuan's integrated circuit industry to accelerate its leap to 100 billion level. Chongchuan District will always carry forward the spirit of "shop waiters", provide all-round service guarantee for the sealed test base project, and contribute to the high-quality development of the manufacturing industry in Chongchuan.
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