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Fully committed to building Nantong into a new highland for the integrated circuit industry—Tongfu Microelectronics Beishan Advanced Packaging and Testing Base Project Officially Signed

Release date:

2022-07-08

　　On the morning of June 27, the Tongfu Microelectronics North Advanced Packaging and Testing Base project was officially signed. Wu Xinming, Deputy Secretary of the Municipal Party Committee and Mayor, attended the event and delivered a speech. Also present were Lu Weidong, Member of the Standing Committee of the Municipal Party Committee and Executive Deputy Mayor; Ling Yi, Member of the Municipal Government Leadership Team and Secretary-General; Chen Lin, Director of the Municipal Government Office; and Hu Yongjun, Secretary of the District Party Committee, among other leaders. Tongfu Microelectronics President Shi Lei also attended the ceremony. Yang Wanping, Deputy Secretary of the District Party Committee and District Mayor; Ding Zhixiang, Director of the North High-Tech Zone Management Committee; and Tongfu Microelectronics President Shi Lei jointly signed the agreement. Additionally, Xia Xin, Hu Wenlong, and Zhuang Zhenming, Vice Presidents of Tongfu Microelectronics; Wu Pinzhong, Deputy General Manager of the Factory Affairs Center; and heads of relevant departments were all present to witness the signing.

　　Mayor Wu Xinming, representing the Municipal Party Committee and the Municipal Government, extended his congratulations on the successful signing of the project. After briefly outlining our city's current status in the integrated circuit industry, he noted that Tongfu Microelectronics is a leading enterprise in China's integrated circuit packaging and testing sector. This latest agreement to establish operations here marks a pivotal step for Tongfu Microelectronics as it moves closer to its ambitious goal of achieving "100 billion yuan in market capitalization, 100 billion yuan in output value, and becoming No. 1 nationwide in the packaging and testing field." This milestone is poised to attract and encourage more upstream and downstream companies to follow suit, investing in Nantong and injecting fresh momentum into the city’s efforts to cluster and scale up its integrated circuit industry. Mayor Wu expressed his hope that Tongfu Microelectronics will continue to champion innovation and leverage cutting-edge technology, adopting the most advanced equipment and processes available globally to build a world-class, domestically leading packaging and testing facility. At the same time, he urged the company to further amplify its industry influence, drawing more landmark projects, high-value enterprises, and top-tier talent to settle in Nantong. Finally, Mayor Wu assured that both the Nantong and Chongchuan governments will remain steadfastly committed to their pro-business philosophy—embracing, nurturing, and empowering businesses—while sparing no effort to deliver the most professional project support, the most comprehensive resource guarantees, and the highest-quality business environment. Together with Tongfu Microelectronics, they will work hand-in-hand to accelerate project commencement, construction, and production, co-creating a bright future filled with shared success and prosperity.

　　President Shi Lei expressed gratitude to the Nantong Municipal Party Committee and Government for their longstanding care and support of Tongfu Microelectronics' development. The president noted that Tongfu Microelectronics' advanced integrated circuit packaging and testing base, built with investment in the North High-tech Zone of Nantong City, encompasses cutting-edge product lines including next-generation 3D memory, automotive electronics, high-performance computing, new energy solutions, and 5G chips. This initiative is dedicated to addressing critical bottlenecks in advanced packaging and testing technologies, expanding production capacity, and strengthening the company's position as an industry leader. President Shi emphasized that Tongfu Microelectronics will accelerate project construction, ramp up R&D investments, bolster talent development, and expedite management improvements—working tirelessly to establish Nantong as a premier hub for the city's burgeoning integrated circuit industry.

　　Hu Yongjun, Secretary of the Chongchuan District Committee, presided over the ceremony and stated that the establishment of Tongfu Microelectronics' North Advanced Packaging and Testing Base project will undoubtedly accelerate Chongchuan's integrated circuit industry toward reaching a 100-billion-yuan scale. Chongchuan District will consistently uphold the "shopkeeper-like" spirit, providing comprehensive support and services for the packaging and testing base project, thereby contributing Chongchuan's "chip-level" expertise to the city's high-quality manufacturing development.

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