On the morning of September 7, the foundation laying and commencement ceremony of Tongfu Chaowei (Suzhou) Microelectronics Co., Ltd. was held in Suzhou Industrial Park.
 

This project is located in the Suzhou area of China (Jiangsu) Pilot Free Trade Zone. It is another major project of Tongfu Microelectronics in the park after Suzhou Tongfu Chaowei Semiconductor Co., Ltd., positioning itself as a domestic leading high-performance computing processor packaging, testing, research, development and production base.
Shen Mi, member of the Standing Committee of the CPC Suzhou Municipal Committee and secretary of the Party Working Committee of the Park, Lin Xiaoming, deputy secretary of the Party Working Committee and director of the Management Committee of the Park, Wan Li, director of the Suzhou Bureau of Industry and Information Technology, Wu Hong, deputy secretary of the Party Working Committee and deputy director of the Management Committee of the Park, Liu Hua and Lu Yuan, members of the Party Working Committee and deputy directors of the Management Committee of the Park, and Zhang Hao, deputy director of the Suzhou Bureau of Commerce; Shi Mingda, chairman of Tongfu Microelectronics, and Shi Lei, president attended the commencement ceremony.

Shi Lei said that after more than ten years of development in the park, Suzhou Tongfu Chaowei provides customers with FCBGA high-end sealed test products. It has the world's advanced flip chip sealed test technology, fully supports the high-end upgrading of various domestic and foreign customers, and provides high-quality sealed test services for high-end processors. This new project will focus on“ High performance computing chip packaging test and advanced packaging industrialization” In both directions, we will use flip chip packaging, multi chip packaging and other advanced packaging and testing technologies to provide integrated packaging and testing solutions for high-performance computing integrated circuits and serve our customers at a higher level. The planned land for the new project is about 155 mu, which is located in the Jinguang Science and Technology Industrial Park in the park. The first phase of the project is planned to be completed and put into operation in 2023.

From the official website of Suzhou Industrial Park Management Committeehttps://www.sipac.gov.cn/szgyyq/jsdt/202209/c04259b2178d40a892ef72e7c0457a7e.shtml