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Tongfu Chaowei's new project breaks ground!

Release date:

2022-09-09

On the morning of September 7, the groundbreaking and commencement ceremony for Tongfu Supermicro (Suzhou) Microelectronics Co., Ltd. was held in Suzhou Industrial Park.

Tongfu Micro

　　This project is located within the Suzhou Area of China (Jiangsu) Pilot Free Trade Zone, marking Tongfu Microelectronics' latest major initiative in the park—following Suzhou Tongfu Supermicro Semiconductor Co., Ltd.—and positioning itself as a cutting-edge R&D and production base for high-performance computing processor packaging and testing, set to achieve a leading domestic standard.
　　Shen Mi, Member of the Standing Committee of the Suzhou Municipal Party Committee and Secretary of the Party Working Committee of the Industrial Park; Lin Xiaoming, Deputy Secretary of the Party Working Committee and Director of the Management Committee of the Industrial Park; Wan Li, Director of the Suzhou Bureau of Industry and Information Technology; Wu Hong, Deputy Secretary of the Party Working Committee and Deputy Director of the Management Committee of the Industrial Park; Liu Hua and Lu Yuan, Members of the Party Working Committee and Deputy Directors of the Management Committee; and Zhang Hao, Deputy Director of the Suzhou Bureau of Commerce attended the groundbreaking ceremony. Also present were Shi Mingda, Chairman, and Shi Lei, President, of Tongfu Microelectronics.

Tongfu Micro

　　Shi Lei stated that, after more than a decade of development in the park, Suzhou Tongfu Supermicro has been providing customers with high-end FCBGA packaging and testing products. The company boasts world-class flip-chip packaging and testing technology, fully supporting domestic and international clients in their pursuit of advanced, cutting-edge solutions—and delivering premium packaging and testing services for high-performance processors. The newly launched project will focus primarily on two key areas: "high-performance computing chip packaging and testing, as well as the industrialization of advanced packaging technologies." Leveraging advanced techniques such as flip-chip packaging and multi-chip testing, the project aims to offer comprehensive packaging and testing solutions tailored for high-performance computing integrated circuits, enabling us to serve our customers at an even higher level. The new project is planned to occupy approximately 155 acres within the JinGuang Science and Technology Industrial Park in the park, with the first phase scheduled for completion and production launch in 2023.

Extracted from the official website of Suzhou Industrial Park Administrative Committee: https://www.sipac.gov.cn/szgyyq/jsdt/202209/c04259b2178d40a892ef72e7c0457a7e.shtml

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