Technology Overview

Low-profile Quad Flat Package (LQFP) refers to a four-sided pin Flat Package with body thickness of 1.0mm or 1.4mm. Mainly suitable for the use of SMT surface mount technology in PCB installation. The distance between the pins of the package is small and the pins are thin. Generally large - scale or very large - scale integrated circuits use this form of package. Pin pitch of 0.4mm-1.0mm and pin number from 32 to 256.

Applications

LQFPs are ideal package for most IC semiconductor technologies such as ASIC, PMU controllers, MCU, gate arrays (FPGA/PLD) and PC chip sets. LQFP packages are particularly well suited for electronic systems requiring broad performance characteristics. Such applications include laptop PCs, video/audio, telecom, RF, data acquisition, set-top box, communication boards and automotive.

Features

　◆ 7*7mm-28*28 mm package sizes available

　◆ 32-256 lead counts

　◆ 0.4, 0.5, 0.65, 0.80 & 1.0 mm lead pitch available

　◆ Lead frame design capability to meet customer requirements including exposed pad

　◆ Gold, copper, and Ag alloy wires interconnect, all equipped with mass production facilities

　◆ High reliability and low cost solution

　◆ RoHS-6 (green) BOM options for 100% of product family

Key capability：

　◆ Automotive products line

　◆ The assembly process includes 2nd/3rd AOI, plasma, X-ray, IR reflow, TC, SAT, etc;

　◆ Total wires max:522 wires in MP(0.7mil Au & Cu wire).

　◆ AEC-Q006/AEC-Q001 /IATF16949 Pass

Technical overview:

　LQFP (Low-profile Quad Flat Package) refers to a four-side pin flat package with a package body thickness of 1.0 or 1.4 mm. It is mainly suitable for installing and wiring on PCB with SMT surface mounting technology. The distance between the pins of the packaging chip is small, and the pins are thin. Generally, large-scale or ultra-large-scale integrated circuits adopt this packaging form. The center distance of pins is 0.4mm-1.0mm and other specifications, and the number of pins ranges from 32 to 256.

Application:

　LQFP is an ideal package for most IC semiconductor technologies, such as ASICs, PMU controllers, microprocessors, gate arrays (FPGAs/PLDs) and PC chipsets. LQFP packaging is particularly suitable for electronic systems that require a wide range of performance characteristics, including notebook computers, video/audio, telecommunications, radio frequency, data acquisition, set-top boxes, communication boards and automobiles.

Features:

　◆ Support 7 * 7mm-28 * 28mm package size

　◆ Number of 32-256 pins

　◆ Support 0.4, 0.5, 0.65, 0.80&1.0 mm pin spacing

　◆ Support customized frame with exposed frame fins

　◆ Adopt gold wire, copper wire and silver wire interconnection mode, and have mass production facilities

　◆ High reliability and low cost solution

　◆ All RoHS-6 (green) materials

Key capabilities:

　◆ Professional car gauge production line

　◆ The assembly process includes 3rd AOI, Plasma, X-ray, IR reflow, TC, SAT, etc

　◆ Maximum number of wires in mass production: 522 (0.7mil Au&Cu wire)

　◆ Passed AEC-Q006/AEC-Q001/IATF16949 certification